Display device

ABSTRACT

A display device includes an active region and a non-active region. The display device includes a display panel and a polarizing member which is disposed on a surface of the display panel, where the display panel and the polarizing member include a first through hole which penetrates the display panel and the polarizing member in a thickness direction and a hole coating layer which is disposed on an inner wall of the polarizing member of the first through hole.

This application is a continuation of U.S. patent application Ser. No.16/688,851, filed on Nov. 19, 2019, which claims priority to KoreanPatent Application No. 10-2019-0043293, filed on Apr. 12, 2019, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention relate to a display device.

2. Description of the Related Art

Electronic devices that provide images to a user, such as smartphones,tablet personal computers (“PCs”), digital cameras, notebook computers,navigation devices and smart televisions, include a display device fordisplaying images.

The display device includes a display panel and components for drivingthe display panel. Recently, components for implementing variousfunctions ether than screen display are also being added to the displaydevice. One example of the above-described display device is asmartphone equipped with optical elements such as a camera and aninfrared sensor.

The display device may include an optical hole in order for lightreception of an optical element. To increase the transmittance of theoptical hole, some members of the display device are physicallypenetrated. A region around a physically penetrating through hole may beexposed to outside air such as moisture.

SUMMARY

Among members constituting a display device, there are members thatdeteriorate when exposed to moisture. A polarizing film may shrink whenmoisture permeates into the polarizing film, for example. The shrinkageof the polarizing film may cause an appearance defect.

Exemplary embodiments of the invention provide a display device capableof preventing permeation of moisture through a through hole.

However, exemplary embodiments of the invention are not restricted tothe one set forth herein. The above and other exemplary embodiments ofthe invention will become more apparent to one of ordinary skill in theart to which the invention pertains by referencing the detaileddescription of the invention given below.

An exemplary embodiment of a display device includes an active regionand a non-active region, and the display device includes a displaypanel, and a polarizing member which is disposed on a first surface ofthe display panel, where a first through hole which penetrates thedisplay panel and the polarizing member in a thickness direction isdefined in the display panel and the polarizing member and the displaypanel and the polarizing member include a hole coating layer which isdisposed on an inner wall of the polarizing member of the first throughhole.

An exemplary embodiment of a display device includes a hole regiondisposed within an active region, and the display device includes adisplay panel which includes a flexible substrate, an active elementlayer disposed on the flexible substrate and including light emittingelements, and a thin-film encapsulation layer disposed on the activeelement layer, a polarizing bonding layer which is disposed on thethin-film encapsulation layer of the display panel, a polarizing filmwhich is disposed on the polarizing bonding layer, a transparent bondinglayer which is disposed on the polarizing film, and a window memberwhich is disposed on the transparent bonding layer and includes a windowbase and a print layer disposed on the window base, where a firstthrough hole which penetrates the flexible substrate, the active elementlayer, the thin-film encapsulation layer, the polarizing bonding layerand the polarizing film in a thickness direction is defined in the holeregion, the hole region includes a hole coating layer which is disposedon an inner wall of the first through hole, a second through hole whichpenetrates the transparent bonding layer in the thickness direction andoverlaps the first through hole is defined in the hole region, and anoptical hole is defined by the print layer and overlaps the firstthrough hole and the second through hole.

In an exemplary embodiment of a display device, a through hole iscovered with a hole coating layer to prevent moisture from permeatingtoward a polarizing member through the through hole. Therefore, it ispossible to prevent a shrinkage defect of the polarizing member due toexposure to moisture and the resultant appearance defect.

However, the effects of the exemplary embodiments are not restricted tothe one set forth herein. The above and other effects of the exemplaryembodiments will become more apparent to one of daily skill in the artto which the exemplary embodiments pertain by referencing the claims.

Other features and exemplary embodiments may be apparent from thefollowing detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other exemplary embodiments will become apparent and morereadily appreciated from the following description of the exemplaryembodiments, taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a plan view of an exemplary embodiment of a display device;

FIG. 2 is a schematic cross-sectional view around the exemplaryembodiment of a bending region of the display device;

FIG. 3 is a cross-sectional view around the exemplary embodiment of ahole region of the display device;

FIG. 4 is a plan view illustrating the planar positional relationshipbetween members around the hole region;

FIG. 5 is a circuit diagram of the exemplary embodiment of one pixel ofthe display device;

FIG. 6 is a cross-sectional view of the exemplary embodiment of onepixel of the display device;

FIG. 7 is a cross-sectional view around the hole region of the displaydevice of FIG. 6;

FIGS. 8 through 11 are cross-sectional views illustrating an exemplaryembodiment of steps of a method of manufacturing a display device;

FIG. 12 is a cross-sectional view around an exemplary embodiment of ahole region of a display device;

FIG. 13 is a cross-sectional view around an exemplary embodiment of ahole region of a display device;

FIGS. 14 and 15 are cross-sectional views of exemplary embodiments ofhole regions of display devices; and

FIG. 16 is a cross-sectional view around an exemplary embodiment of ahole region of a display device.

DETAILED DESCRIPTION

The invention will now be described more fully hereinafter withreference to the accompanying drawings, in which preferred embodimentsof the invention are shown. This invention may, however, be embodied indifferent forms and should not be construed as limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this invention will be thorough and complete, and willfilly convey the scope of the invention to those skilled in the art.

It will also be understood that when a layer is referred to as being“on” another layer or substrate, it can be directly on the other layeror substrate, or intervening layers may also be present. In contrast,when an element is referred to as being “directly on” another element,there are no intervening elements present.

Although the terms “first”, “second”, etc. may be used herein todescribe various elements, these elements, should not be limited bythese terms. These terms may be used to distinguish one element fromanother element. Thus, a first element discussed below may be termed asecond element without departing from teachings of one or moreembodiments. The description of an element as a “first” element may notrequire or imply the presence of a second element or other elements. Theterms “first”, “second”, etc. may also be used herein to differentiatedifferent categories or sets of elements. For conciseness, the terms“first”, “second”, etc. may represent “first-category (or first-set)”,“second-category (or second-set)”, etc., respectively.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

In concluding the detailed description, those skilled in the art willappreciate that many variations and modifications may be made to thepreferred embodiments without substantially departing from theprinciples of the invention. Therefore, the disclosed preferredembodiments of the invention are used in a generic and descriptive senseonly and not for purposes of limitation.

Hereinafter, specific embodiments will be described with reference tothe attached drawings.

FIG. 1 is a plan view of an exemplary embodiment of a display device 1.In exemplary embodiments, a first direction DR1 and a second directionDR2 are different directions intersecting each other, for example,directions perpendicularly intersecting each other in a plan view. Athird direction DR3 is a direction intersecting a plane in which thefirst direction DR1 and the second direction DR2 lie, for example, adirection perpendicularly intersecting both the first direction DR1 andthe second direction DR2. In the drawings, the first direction DR1indicates a vertical direction of the display device 1, the seconddirection DR2 indicates a horizontal direction of the display device 1,and the third direction DR3 indicates a thickness direction of thedisplay device 1. In the following embodiments, one side in the firstdirection DR1 refers to an upward direction in a plan view, the otherside in the first direction DR1 refers to a downward direction in a planview, one side in the second direction DR2 refers to a right directionin a plan view, the other side in the second direction DR2 refers to aleft direction in a plan view, one side in the third direction DR3refers to an upward direction in cross-sectional view, and the otherside in the third direction DR3 refers to a downward direction incross-sectional view. However, directions mentioned in exemplaryembodiments should be understood as relative directions, and theexemplary embodiments are not limited to the mentioned directions.

Referring to FIG. 1, the display device 1 displays moving images orstill images. A display direction of a main screen may be the one sidein the third direction DR3 (e.g., a top emission display device), butmay also be the other side in the third direction DR3 (e.g., a bottomemission display device) or both the one side and the other side in thethird direction DR3 (e.g., a double-sided emission display device or atransparent display device).

The display device 1 may refer to any electronic device that provides adisplay screen. Examples of the display device 1 may include portableelectronic devices that provide a display screen, such as a mobilephone, a smartphone, a tablet personal computer (“PC”), an electronicwatch, a smart watch, a watch phone, a mobile communication terminal, anelectronic notebook, an electronic book, a portable multimedia player(“PMP”), a navigation device, a game machine and a digital camera, aswell as a television, a notebook computer, a monitor, a billboard andthe Internet of things.

The display device 1 includes an active region AAR and a non-activeregion NAR. In the display device 1, a portion in which a screen isdisplayed may be defined as a display region, and a portion in which noscreen is displayed may be defined as a non-display region. In thiscase, the display region may be included in the active region AAR. Whenthe display device 1 has a touch function, a touch region in which atouch input is sensed may also be included in the active region AAR. Thedisplay region and the touch region may overlap each other. That is, theactive region AAR may be a region where a screen is displayed and atouch input is sensed.

The active region AAR may include a plurality of pixels PX. The pixelsPX may be arranged in a matrix direction. Each of the pixels PX may berectangular or square in a plan view (that is, when seen from above).However, the planar shape of each of the pixels PX is not limited to theabove examples and may also have various other shapes such as a rhombicshape including each side inclined with respect to the first directionDR1. Each of the pixels PX may include a light emitting region EMA(refer to FIG. 6) and a non-light emitting region NEM (refer to FIG. 6).The non-light emitting region NEM may be provided in a lattice shape ora mesh shape in a plan view and may surround the light emitting regionsEMA.

The active region AAR may be shaped like a rectangle or a rectangle withrounded corners. The active region AAR illustrated in the drawings isshaped like a rectangle that includes rounded corners and is longer inthe first direction DR1 than in the second direction DR2. However, theshape of the active region AAR is not limited to this shape, and theactive region AAR may have various shapes such as a rectangle that islonger in the second direction DR2 than in the first direction DR1, asquare or other polygons, a circle, and an ellipse.

The non-active region NAR is disposed around the active region AAR. Thenon-active region NAR may be a bezel region. The non-active region NARmay overlap a print layer 22 of a window member 20 to be describedlater.

The non-active region NAR may surround all sides (four sides in thedrawings) of the active region AAR. However, the invention is notlimited to this case. In an exemplary embodiment, the non-active regionNAR may not be disposed around an upper side of the active region AAR,for example.

In the non-active region NAR, signal wirings or driving circuits fortransmitting signals to the active region AAR (the display region or thetouch region) may be disposed. The non-active region NAR may not includethe display region. Further, the non-active region NAR may not includethe touch region. In an exemplary embodiment, the non-active region NARmay include a portion of the touch region, and a sensor member such as apressure sensor may be disposed in the portion. In some exemplaryembodiments, the active region AAR may be exactly the same as thedisplay region where a screen is displayed, and the non-active regionNAR may be exactly the same as the non-display region where no screen isdisplayed.

The display device 1 may further include a hole region HLA including atleast one hole HLE. The hole region HLA will be described in detaillater.

FIG. 2 is a schematic cross-sectional view around the exemplaryembodiment of a bending region BR of the display device 1. FIG. 2schematically illustrates a cross-section of the display device 1, andthe detailed cross-sectional structure of the display device 1 will bedescribed in detail later with reference to FIG. 6.

Referring to FIGS. 1 and 2, the display device 1 includes a displaypanel 10 that provides a display screen. Examples of the display panel10 include an organic light emitting display panel, a micro lightemitting diode (“LED”) display panel, a nano LED display panel, aquantum dot light emitting display panel, a liquid crystal displaypanel, a plasma display panel, a field emission display panel, anelectrophoretic display panel, and an electrowetting display panel. Acase where an organic light emitting display panel is applied as anexample of the display panel 10 will be described below, but theinvention is not limited to this case, and other display panels may alsobe applied as long as the same technical spirit is applicable.

The display device 1 may further include a touch member that senses atouch input. The touch member may be integrated into the display panel10 in the form of a touch layer TSP as exemplified in the followingembodiments. However, the invention is not limited to this case, and thetouch member may also be provided as a separate member from the displaypanel 10 in the form of a touch panel or a touch film and then attachedonto the display panel 10.

In an exemplary embodiment, the display panel 10 may include a flexiblesubstrate 100 including a flexible polymer material such as polyimide.Accordingly, the display panel 10 may be deformable, e.g., bent, curved,folded, or rolled.

The display panel 10 may include the bending region BR where the displaypanel 10 is bent. The display panel 10 may be divided into a main regionMR located on a side of the bending region BR and a sub region SRlocated on the other side of the bending region BR.

The display region of the display panel 10 is disposed in the mainregion MR. In an exemplary embodiment, an edge portion around thedisplay region in the main region MR, the whole of the bending regionBR, and the whole of the sub region SR may be the non-display region.However, the bending region BR and/or the sub region SR may also includethe display region.

The shape of the main region MR may be substantially similar to theplanar shape of the display device 1. The main region MR may be a flatregion located in one plane. However, the invention is not limited tothis case, and at least one of edges of the main region MR excluding anedge (side) connected to the bending region BR may also be curved or maybe bent perpendicularly.

If at least one of the edges of the main region MR excluding the edge(side) connected to the bending region BR is curved or bent, the displayregion may also be disposed at the curved or bent edge. However, theinvention is not limited to this case, and the curved or bent edge mayalso be the non-display region where no screen is displayed or mayinclude a combination of the display region and the non-display region.

An active element layer ATL, a thin-film encapsulation layer 190 and thetouch layer TSP may be disposed on one surface of the substrate 100 inthe main region MR. In FIG. 2, the active element layer ATL, thethin-film encapsulation layer 190 and the touch layer TSP areschematically illustrated for ease of description. The more detailedcross-sectional structure of these elements will be described later withreference to FIG. 6.

The active element layer ATL may include light emitting elements andthin-film transistors (“TFTs”) for driving the light emitting elements.The thin-film encapsulation layer 190 may cover the active element layerATL to prevent the active element layer ATL from being exposed tomoisture or air. The touch layer TSP may be disposed on the thin-filmencapsulation layer 190. The touch layer TSP may include a plurality oftouch electrodes. The touch electrodes may be provided in a mesh shape.In another exemplary embodiment, the touch layer TSP may be omitted.

The display device 1 may further include a polarizing member POLdisposed on the display panel 10. The polarizing member POL polarizeslight that passes therethrough. The polarizing member POL may reducereflection of external light. The polarizing member POL may be attachedonto the touch layer TSP by a polarizing bonding layer PLA. When thetouch layer TSP is omitted, the polarizing member POL may be attachedonto the thin-film encapsulation layer 190.

The polarizing member POL may be disposed in the main region MR and, insome cases, may be further disposed in the bending region BR or the subregion SR. In another exemplary embodiment, the polarizing member POLmay be omitted.

Although not illustrated, a cover panel may be disposed on other surfaceof the substrate 100. In an exemplary embodiment, the cover panel mayinclude a heat dissipation layer, a cushion layer, etc., for example.

The bending region BR is connected to other side of the main region MRin the first direction DR1. In an exemplary embodiment, the bendingregion BR may be connected to a lower short side of the main region MR,for example. The width of the bending region BR may be smaller than thewidth of (the short side of) the main region MR. A connection portionbetween the main region MR and the bending region BR may have an L-cutshape.

In the bending region BR, the display panel 10 may be bent with acurvature toward the other side in the third direction DR3. The bendingregion BR may have a constant radius of curvature. However, theinvention is not limited to this case, and the bending region BR mayalso have a different radius of curvature in each section. As thedisplay panel 10 is bent in the bending region BR, a surface of thedisplay panel 10 may be reversed. That is, a surface of the displaypanel 10 which faces upward may be changed to face outward through thebending region BR and then to face downward.

A bending protection layer BPL may be disposed in the bending region BR.The bending protection layer BPL may be disposed on the one surface ofthe substrate 100. The bending protection layer BPL may include, e.g.,resin to protect the bending region BR. The bending protection layer BPLmay be disposed to overlap not only the bending region BR but also aportion of the main region MR and a portion of the sub region SRadjacent to the bending region BR.

The sub region SR extends from the bending region BR. The sub region SRmay extend parallel to the main region MR after the completion ofbending. The sub region SR may overlap the main region MR in the thirddirection DR3, that is, in the thickness direction of the display panel10. The width of the sub region SR (in the second direction DR2) may be,but not necessarily, the same as the width of the bending region BR.

A driver chip IC may be disposed in the sub region SR. The driver chipIC may include an integrated circuit for driving the display panel 10.The integrated circuit may include an integrated circuit for a displayand/or an integrated circuit for a touch member. The integrated circuitfor a display and the integrated circuit for a touch member may beprovided as separate chips or may be integrated into one chip. Thedriver chip IC may be disposed on a driving substrate FPC or anotherexternal printed circuit board (“PCB”) connected to the drivingsubstrate FPC.

A pad portion may be disposed at an end of the sub region SR of thedisplay panel 10. The pad portion may include a plurality of displaysignal wiring pads and a plurality of touch signal wiring pads. Thedriving substrate FPC may be connected to the pad portion at the end ofthe sub region SR of the display panel 10. The driving substrate FPC maybe a flexible PCB (“FPCB”) or film.

The display panel 10 may further include protective films PF1 and PF2disposed in an overlap region between the main region MR and the subregion SR. In an exemplary embodiment, a first protective film PF1 maybe attached to the other surface of the substrate 100 in the main regionMR, and a second protective film PF2 may be attached to the othersurface of the substrate 100 in the sub region SR, for example. Thefirst protective film PF1 and the second protective film PF2 may faceeach other and may be bonded together by a bonding layer PSA such as anadhesive or a gluing agent. Accordingly, the mechanical stability of thebending structure may be improved.

The display device 1 may further include the window member 20. Thewindow member 20 may cover and protect the display panel 10. The windowmember 20 may be attached onto a surface of the display panel 10 by atransparent bonding layer 30 including an optical clear adhesive or anoptical clear resin. When the display device 1 includes the polarizingmember POL, the window member 20 may be attached onto a surface of thepolarizing member POL.

The window member 20 may include a window base 21 and the print layer 22disposed on the window base 21.

The window base 21 may include a transparent material. In an exemplaryembodiment, the window base 21 may include, for example, glass orplastic. When the window base 21 includes plastic, it may have flexibleproperties.

Examples of plastic applicable to the window base 21 include, but arenot limited to, polyimide, polyacrylate, polymethyl methacrylate(“PMMA”), polycarbonate (“PC”), polyethylene naphthalate (“PEN”),polyvinylidene chloride, polyvinylidene difluoride (“PVDF”),polystyrene, ethylene vinylalcohol copolymer, polyethersulphone (“PES”),polyetherimide (“PEI”), polyphenylene sulfide (“PPS”), polyallylate,triacetyl cellulose (“TAC”), and cellulose acetate propionate (“CAP”).

The planar shape of the window base 21 corresponds to the shape of thedisplay device 1 to which the window base 21 is applied. In an exemplaryembodiment, when the display device 1 is substantially rectangular in aplan view, the window base 21 may also be substantially rectangular, forexample. In another exemplary embodiment, when the display device 1 iscircular, the window base 21 may also be circular.

The window base 21 may be larger than the display panel 10 in a planview, and its side surfaces may protrude from side surfaces of thedisplay panel 10. The window base 21 may protrude outward from all sides(four sides in the drawings) of the display panel 10.

The print layer 22 may be disposed on the window base 21. The printlayer 22 may be disposed on a surface and/or the other surface of thewindow base 21. The print layer 22 may be disposed on an edge portion ofthe window base 21 and disposed in the non-active region NAR. Inaddition, the print layer 22 may be disposed in the hole region HLA. Theprint layer 22 may be a light shielding layer or a decorative layer foraesthetic purposes.

The hole region HLA of the display device 1 will now be described indetail.

FIG. 3 is a cross-sectional view around the exemplary embodiment of thehole region HLA of the display device 1. FIG. 4 is a plan viewillustrating the planar positional relationship between members aroundthe hole region HLA.

Referring to FIGS. 1 through 4, the hole region HLA may be disposed onone side of the display device 1 in the first direction DR1. The holeregion HLA itself may be the non-active region NAR where display and/ortouch is not performed. The hole region HLA may be disposed inside theactive region AAR. That is, the hole region HLA may be surrounded by theactive region AAR as illustrated in FIG. 1. In another example, the holeregion HLA may be surrounded by the non-active region NAR or may bedisposed around a boundary between the active region AAR and thenon-active region NAR such that a portion of the hole region HLA issurrounded by the active region AAR and the other portion is surroundedby the non-active region NAR.

The hole region HLA may be shaped like a circle, an ellipse, a dumbbell,or a rectangle with convex short sides in a plan view. However, theshape of the hole region HLA is not limited to these examples and may bechanged to various shapes such as a rectangle, a square and otherpolygons.

At least one hole HLE may be defined in the hole region HLA. In anexemplary embodiment, the hole HLE may be, but is not limited to,circular or elliptical, for example.

The hole HLE may include a physically penetrating through hole HLE_TH.The through hole HLE_TH may include a first through hole HLE_TH1 whichphysically penetrates the display panel 10 and the polarizing memberPOL. In addition, the through hole HLE_TH may further include a secondthrough hole HLE_TH2 which penetrates the transparent bonding layer 30.As the above members are removed from the through hole HLE_TH, lighttransmittance in this region may be improved.

The second through hole HLE_TH2 of the transparent bonding layer 30 maycompletely overlap the first through hole HLE_TH1. An inner diameter ofthe second through hole HLE_TH2 may be smaller than an inner diameter ofthe first through hole HLE_TH1 of a laminate of the display panel 10 andthe polarizing member POL. In a plan view, the second through holeHLE_TH2 may be located inside the first through hole HLE_TH1. An innerwall of the second through hole HLE_TH2 may protrude inward from aninner wall of the first through hole HLE_TH1. Further, the inner wall ofthe second through hole HLE_TH2 may protrude inward from a hole coatinglayer HCVB to be described later. However, the invention is not limitedto this case. The second through hole HLE_TH2 of the transparent bondinglayer 30 may also have the same inner diameter as the first through holeHLE_TH1, and the inner wall of the second through hole HLE_TH2 may alsobe aligned with the inner wall of the first through hole HLE_TH1. Inaddition, a portion of the second through hole HLE_TH2 of thetransparent bonding layer 30 may be located outside the first throughhole HLE_TH1.

The window member 20 may not be physically penetrated in a regionoverlapping the through hole HLE_TH. Since the window base 21 of thewindow member 20 itself has high light transmittance, high lighttransmittance may be maintained although the window member 20 is notpenetrated. In addition, since the window member 20 physically coversthe region without being penetrated, it may protect members disposedunder the window member 20.

An optical hole HLE_OP which is an optical light transmitting window maybe defined in the hole region HLA, in addition to the through holeHLE_TH. The optical hole HLE_OP may overlap the through hole HLE_TH andmay be defined by a pattern of the print layer 22 of the window member20. The print layer 22 may be disposed in a part of the hole region HLAto prevent light of pixels PX from being output (e.g., leakage of light)through the through hole HLE_TH. The print layer 22 may extend up to theouter periphery of the hole region HLA, but the invention is not limitedto this case.

The print layer 22 is disposed around the through hole HLE_TH andexposes at least a portion of the through hole HLE_TH. A region of thethrough hole HLE_TH exposed by the print layer 22 may be the opticalhole HLE_OP through which light is transmitted. In an exemplaryembodiment, the print layer 22 of the hole region HLA may partiallyoverlap the through hole HLE_TH. That is, an inner side surface of theprint layer 22 may protrude inward from an inner wall of the throughhole HLE_TH.

When the through hole HLE_TH is circular in a plan view, a region inwhich the through hole HLE_TH and the print layer 22 overlap each othermay be donut-shaped. However, the invention is not limited to this case,and an inner wall of the print layer 22 of the hole region HLA may alsobe aligned with an inner wall of the through hole HLE_TH which has aminimum radius or may be located outside the inner wall of the throughhole HLE_TH such that the through hole HLE_TH and the print layer 22 donot overlap each other. Even when the inner wall of the print layer 22of the hole region HLA is located outside the inner wall of the throughhole HLE_TH, when a coating layer having a light shielding function isdisposed on the inner wall of the through hole HLE_TH, the leakage oflight through the region may be prevented.

The display device 1 may further include an optical element OPSincluding a light receiving portion. Examples of the optical element OPSincluding the light receiving portion may include a camera, a lens (acondensing lens, a light guide lens, etc.), and optical sensors such asan infrared sensor, an iris recognition sensor and an illuminancesensor. The optical element OPS may be disposed on the other surfaceside of the display panel 10 to overlap the hole region HLA. At least apart of the light receiving portion of the optical element OPS may belocated inside the optical hole HLE_OP. Light outside the display device1 may pass through the window base 21 surrounded by the print layer 22and enter the light receiving portion through the through hole HLE_THdisposed under the window base 21. When the window base 21 has highlight transmittance as described above, external light may reach thelight receiving portion of the optical element OPS through the aboveoptical path without a large loss.

The hole coating layer HCVB (or a hole cover layer) may be disposed onthe inner wall of the first through hole HLE_TH1 of the hole region HLA.The hole coating layer HCVB may cover the entire inner wall of the firstthrough hole HLE_TH1 of the display panel 10 and the polarizing memberPOL. The hole coating layer HCVB may overlap the print layer 22, and theinner side surface of the print layer 22 may protrude inward from thehole coating layer HCVB.

The hole coating layer HCVB may include a resin having water resistanceand chemical resistance. When moisture permeates into the polarizingmember POL, the polarizing member POL may discolor, and a localshrinkage defect may occur around the first through hole HLE_TH1. Thus,an appearance defect may be detected in the entire hole region HLA.However, when the hole coating layer HCVB having water resistance andchemical resistance is disposed on the inner wall of the first throughhole HLE_TH1 as in the exemplary embodiment, a path through whichmoisture may permeate into the polarizing member POL may be blocked.Accordingly, the above defect of the hole region HLA may be prevented.In addition, since the hole coating layer HCVB blocks moisture or thelike from permeating into the display panel 10 through the first throughhole HLE_TH1, degradation of an organic layer (an organic light emittinglayer) of the display panel 10 due to moisture may be prevented. Thehole coating layer HCVB may not be disposed on the inner wall of thesecond through hole HLE_TH2.

The hole coating layer HCVB may include black resin including a blackdye or a black pigment. When the hole coating layer HCVB includes theblack resin, the leakage of light through the hole region HLA may beprevented. In addition, even when the inner wall of the first throughhole HLE_TH1 is not completely covered by the print layer 22 of the holeregion HLA due to an alignment error or according to an intended design,the leakage of light through the first through hole HLE_TH1 may beeffectively blocked.

In an exemplary embodiment, the hole coating layer HCVB may have auniform thickness along an outer circumference of the first through holeHLE_TH1. In addition, the hole coating layer HCVB may have a uniformthickness in the thickness direction.

Next, the pixel circuit and the detailed cross-sectional structure ofthe display device 1 described above will be described.

FIG. 5 is a circuit diagram of the exemplary embodiment of one pixel PXof the display device 1.

Referring to FIG. 5, a pixel circuit may include a first transistor TR1,a second transistor TR2, a capacitor Cst, and an organic light emittingdiode OLED. Each pixel circuit is connected to a scan line SL, a dataline DL, and a first power supply voltage line ELVDDL.

The first transistor TR1 may be a driving transistor, and the secondtransistor TR2 may be a switching transistor. Although the firsttransistor TR1 and the second transistor TR2 are all p-channel metaloxide semiconductor (“PMOS”) transistors in the drawing, any one or bothof the first transistor TR1 and the second transistor TR2 may also be anre-channel metal oxide semiconductor (“NMOS”) transistor.

A first electrode (source electrode) of the first transistor TR1 isconnected to the first power supply voltage line ELVDDL, and a secondelectrode (drain electrode) of the first transistor TR1 is connected toan anode of the organic light emitting diode OLED. A first electrode(source electrode) of the second transistor TR2 is connected to the dataline DL, and a second electrode (drain electrode) of the secondtransistor TR2 is connected to a gate electrode of the first transistorTR1. The capacitor Cst is connected between the gate electrode and thefirst electrode of the first transistor TR1. A cathode of the organiclight emitting diode OLED receives a second power supply voltage ELVSS.The second power supply voltage ELVSS may be lower than a first powersupply voltage ELVDD provided by the first power supply voltage lineELVDDL.

The second transistor TR2 may output a data signal transmitted to thedata line DL in response to a scan signal transmitted to the scan lineGL. The capacitor Cst may be charged with a voltage corresponding to thedata signal received from the second transistor TR2. The firsttransistor TR1 may control a driving current flowing through the organiclight emitting diode OLED according to the amount of charge stored inthe capacitor Cst.

The equivalent circuit of FIG. 5 is merely one example, and the pixelcircuit may also include a greater number (e.g., seven) of transistorsand capacitors.

FIG. 6 is a cross-sectional view of the exemplary embodiment of onepixel PX of the display device 1.

Referring to FIG. 6, the thin-film element layer ATL of the displaypanel 10 of the display device 1 may include the substrate 100, a bufferlayer 105, a semiconductor layer 110, a first insulating layer 121, afirst gate conductive layer 130, a second insulating layer 122, a secondgate conductive layer 140, a third insulating layer 123, a dataconductive layer 150, a fourth insulating layer 124, an anode 160, abank layer 126 including an opening that exposes the anode 160, a lightemitting layer 170 disposed in the opening of the bank layer 126, and acathode 180 disposed on the light emitting layer 170 and the bank layer126. Each of the above layers may be a single layer or a stack of aplurality of layers. Another layer may also be disposed between theabove layers.

The substrate 100 supports each layer disposed on the substrate 100. Thesubstrate 100 may include an insulating material such as polymer resin.In an exemplary embodiment, the polymer material may be, for example,polyethersulphone (“PES”), polyacrylate (“PA”), polyarylate (“PAR”),plyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethyleneterephthalate (“PET”), polyphenylene sulfide (“PPS”), polyallylate,polyimide (“PI”), polycarbonate (“PC”) cellulose triacetate (“CAT”),cellulose acetate propionate: (“CAP”), or a combination of thesematerials. In an exemplary embodiment, the substrate 100 may alsoinclude an inorganic material such as glass or quartz.

In an exemplary embodiment, the substrate 100 may include a plurality ofsub-substrates 101 and 102. In an exemplary embodiment, the substrate100 may include a first sub-substrate 101 and a second sub-substrate 102stacked in the thickness direction, for example. Each of the firstsub-substrate 101 and the second sub-substrate 102 may be a flexiblesubstrate including, e.g., polyimide. The substrate 100 may furtherinclude a barrier layer 103 disposed between the first sub-substrate 101and the second sub-substrate 102. In an exemplary embodiment, thebarrier layer 103 may include silicon nitride, silicon oxide, or siliconoxynitride, for example. Although not illustrated, a barrier layer mayalso be disposed on the second sub-substrate 102.

The buffer layer 105 is disposed on the substrate 100. In an exemplaryembodiment, the buffer layer 105 may include silicon nitride, siliconoxide, or silicon oxynitride, for example.

The semiconductor layer 110 is disposed on the buffer layer 105. Thesemiconductor layer 110 forms a channel of a TFT of the pixel PX. Thesemiconductor layer 110 may include polycrystalline silicon. However,the material of the semiconductor layer 110 is not limited topolycrystalline silicon, and the semiconductor layer 110 may alsoinclude monocrystalline silicon, low-temperature polycrystallinesilicon, amorphous silicon, or an oxide semiconductor. Examples of theoxide semiconductor may include a binary compound (ABx), a ternarycompound (ABxCy) and a quaternary compound (ABxCyDz) including indium,zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr),magnesium (Mg), etc.

The first insulating layer 121 is disposed on the semiconductor layer110. The first insulating layer 121 may be a gate insulating film havinga gate insulating function. The first insulating layer 121 may include asilicon compound, a metal oxide, or the like. In an exemplaryembodiment, the first insulating layer 121 may include silicon oxide,silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide,hafnium oxide, zirconium oxide, titanium oxide, etc., for example.

The first gate conductive layer 130 is disposed on the first insulatinglayer 121. The first gate conductive layer 130 may include a gateelectrode GAT of the TFT of the pixel PX, a scan line connected to thegate electrode GAT, and a storage capacitor first electrode CE1.

In an exemplary embodiment, the first gate conductive layer 130 mayinclude one or more metals including at least one of molybdenum (Mo),aluminum (Al), platinum (Pt), palladium (Pd) silver (Ag), magnesium(Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr) calcium (Cr), titanium (Ti), tantalum (Ta), tungsten (W) and copper(Cu), for example.

The second insulating layer 122 may be disposed on the first gateconductive layer 130. The second insulating layer 122 may be aninterlayer insulating film or a second gate insulating film. In anexemplary embodiment, the second insulating layer 122 may include aninorganic insulating material such as silicon oxide, silicon nitride,silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide,tantalum oxide or zinc oxide.

The second gate conductive layer 140 is disposed on the secondinsulating layer 122. The second gate conductive layer 140 may include astorage capacitor second electrode CE2. In an exemplary embodiment, thesecond gate conductive layer 140 may include one or more metalsincluding at least one of molybdenum (Mo), aluminum (Al), platinum (Pt),palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium(Ti), tantalum (Ta), tungsten (W) and copper (Cu), for example. Thesecond gate conductive layer 140 may include, but not limited to, thesame material as that of the first gate conductive layer 130.

The third insulating layer 123 is disposed on the second gate conductivelayer 140. The third insulating layer 123 may be an interlayerinsulating film. In an exemplary embodiment, the third insulating layer123 may include an inorganic insulating material such as silicon oxide,silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide,titanium oxide, tantalum oxide or zinc oxide.

The data conductive layer 150 is disposed on the third insulating layer123, The data conductive layer 150 may include a first electrode SD1 anda second electrode SD2 of the TFT of the pixel PX. The first electrodeSD1 and the second electrode SD2 of the TFT may be electricallyconnected to a source region and a drain region of the semiconductorlayer 110 through contact holes penetrating the third insulating layer123, the second insulating layer 122 and the first insulating layer 121.A first power supply voltage electrode ELVDDE of the pixel PX may alsoinclude the data conductive layer 150. The first power supply voltageelectrode ELVDDE may be electrically connected to the storage capacitorsecond electrode CE2 through a contact hole penetrating the thirdinsulating layer 123.

In an exemplary embodiment, the data conductive layer 150 may includeone or more metals including at least one of aluminum (Al), molybdenum(Mo), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold(Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium(Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu), forexample. The data conductive layer 150 may be a single layer or amultilayer. In an exemplary embodiment, the data conductive layer 150may have a stacked structure of Ti/Al/Ti, Mo/Al/Mo, Mo/AlGe/Mo, or Ti/Cufor example.

The fourth insulating layer 124 is disposed on the data conductive layer150. The fourth insulating layer 124 covers the data conductive layer150. The fourth insulating layer 124 may be a via layer, in an exemplaryembodiment, the fourth insulating layer 24 may include an organicinsulating material such as polyacrylates resin, epoxy resin, phenolicresin, polyamides resin, polyimides resin, unsaturated polyesters resin,polyphenylenethers resin, polyphenylenesulfides resin orbenzocyclobutene (“BCD”).

The anode 160 is disposed on the fourth insulating layer 124. The anode160 may be a pixel electrode provided in each pixel PX. The firstelectrode 161 may be electrically connected to the second electrode SD2of the TFT through a contact hole penetrating the fourth insulatinglayer 124. The anode 160 may at least partially overlap the lightemitting region EMA of the pixel PX.

In an exemplary embodiment, the anode 160 may have, but not limited to,a stacked structure in which a material layer having a high workfunction such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”),zinc oxide (ZnO) or indium oxide (In₂O₃) and a reflective material layersuch as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead(Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr), lithium (Li), calcium (Ca) or a combination of the same arestacked. The material layer having a high work function may be disposedon the reflective material layer to be close to the light emitting layer170. In an exemplary embodiment, the anode 160 may have a multilayerstructure of, but not limited to, ITO/Mg, ITO/MgF, ITO/Ag, orITO/Ag/ITO, for example.

The bank layer 126 may be disposed on the anode 160. The bank layer 126may be disposed on the anode 160 and may include an opening exposing theanode 160. The light emitting region EMA and the non-light emittingregion NEM may be distinguished from each other by the bank layer 126and the opening of the bank layer 126. In an exemplary embodiment, thebank layer 126 may include an organic insulating material such aspolyacrylates resin, epoxy resin, phenolic resin, polyamides resin,polyimides resin, unsaturated polyesters resin, polyphenylenethersresin, polyphenylenesulfides resin or BCB. The bank layer 126 may alsoinclude an inorganic material.

A spacer 127 may be disposed on the bank layer 126. The spacer 127 maybe disposed directly on the bank layer 126. The spacer 127 may overlapthe bank layer 126 in the thickness direction. The spacer 127 maymaintain a gap between the bank layer 126 and a structure disposed onthe spacer 127. In an exemplary embodiment, the spacer 127 may prevent afine metal mask (“FMM”) from sagging when an organic material of thelight emitting layer 170 is deposited through the FMM, for example. Insome cases, the spacer 127 may support a structure stacked on the spacer127 or may reduce deformation due to stress when the display panel 10 ispressed. The spacer 127 may be narrower than the bank layer 126. Thespacer 127 may be disposed only on a portion of the bank layer 126, thuscausing a step difference from a portion where the spacer 127 is notpresent.

The spacer 127 may include an organic insulating material, like the banklayer 126. The spacer 127 may include a different layer from the banklayer 126, but may also include the same material as that of the banklayer 126 through a single process. In an exemplary embodiment, the banklayer 126 and the spacer 127 may be provided to have different heightsin a single process by applying a photosensitive organic material andthen exposing and developing the photosensitive organic material using aslit mask or a halftone mask, for example.

The light emitting layer 170 is disposed on the anode 160 exposed by thebank layer 126. The light emitting layer 170 may include an organicmaterial layer. The organic material layer of the light emitting layer170 may include an organic light emitting layer and may further includea hole injection/transport layer and/or an electron injection/transportlayer.

The cathode 180 may be disposed on the light emitting layer 170. Thecathode 180 may be a common electrode disposed entirely withoutdistinction between pixels. The anode 160, the light emitting layer 170,and the cathode 180 may form an organic light emitting element.

The cathode 180 may contact not only the light emitting layer 170 butalso an upper surface of the bank layer 126. In addition, in a regionwhere the spacer 127 is provided, the cathode 180 may contact a surfaceof the spacer 127 and cover the surface of the spacer 127. The cathode180 may be provided in a conformal manner along a structure disposedunder the cathode 180 so as to reflect a step of the structure.

In an exemplary embodiment, the cathode 180 may include a material layerhaving a small work function, such as Li, Ca, LiF/Ca, LiF/Al, Al, Mg,Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, or a compound or combination ofthe same (e.g., a combination of Ag and Mg). The cathode 180 may furtherinclude a transparent metal oxide layer disposed on the material layerhaving a small work function.

The thin-film encapsulation layer 190 including a first inorganic layer191, a first organic layer 192, and a second inorganic layer 193 isdisposed on the cathode 180. The first inorganic layer 191 and thesecond inorganic layer 193 may contact each other at an end of thethin-film encapsulation layer 190 (refer to FIG. 7). The first organiclayer 192 may be sealed by the first inorganic layer 191 and the secondinorganic layer 193.

In an exemplary embodiment, each of the first inorganic layer 191 andthe second inorganic layer 193 may include silicon nitride, siliconoxide, or silicon oxynitride, for example. In an exemplary embodiment,the first organic layer 192 may include an organic insulating materialsuch as polyacrylates resin, epoxy resin, phenolic resin, polyamidesresin, polyimides resin, unsaturated polyesters resin, polyphenylenetherresin, polyphenylenesulfide resin or BCB.

The touch layer TSP may be disposed on the thin-film encapsulation layer190. The touch layer TSP may include a touch base layer 205, a firsttouch conductive layer 210, a first touch insulating layer 215, a secondtouch conductive layer 220, and a second touch insulating layer 230sequentially stacked on the thin-film encapsulation layer 190. Any one(e.g., the second touch conductive layer 220) of the first touchconductive layer 210 and the second touch conductive layer 220 may forma mesh electrode constituting a touch sensing electrode, and the otherone (e.g., the first touch conductive layer 210) may serve as aconnection electrode for connecting adjacent touch sensing electrodes.The first touch conductive layer 210 and the second touch conductivelayer 220 may overlap the bank layer 126 and may be disposed in thenon-light emitting region NEM. Since the first touch conductive layer210 and the second touch conductive layer 220 do not overlap the lightemitting region EMA, even when they include an opaque metal, they maynot substantially reduce the luminance of the display device 1 and maynot be visible to a user.

The touch base layer 205 of the touch layer TSP may include an inorganicinsulating material. In an exemplary embodiment, the touch base layer205 may include a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer,for example. In some exemplary embodiments, the touch base layer 205 maybe replaced with the second inorganic layer 193 constituting thethin-film encapsulation layer 190.

Each of the first touch conductive layer 210 and the second touchconductive layer 220 may include a metal or a transparent conductivelayer. The metal may include aluminum, titanium, copper, molybdenum,silver, or an alloy of the same. In an exemplary embodiment, thetransparent conductive layer may include a transparent conductive oxidesuch as ITO, IZO, zinc oxide (ZnO) or indium tin zinc oxide (“ITZO”), aconductive polymer such as PEDOT, metal nanowires, graphene, etc. Asdescribed above, when the first touch conductive layer 210 and thesecond touch conductive layer 220 are disposed in the non-light emittingregion NEM, they may not interfere with the propagation of emitted lighteven when they include an opaque metal with low resistivity.

The first touch conductive layer 210 and/or the second touch conductivelayer 220 may include a multilayered conductive layer. In an exemplaryembodiment, the first touch conductive layer 210 and/or the second touchconductive layer 220 may have a three-layer structure oftitanium/aluminum/titanium, for example.

The first touch insulating layer 215 and the second touch insulatinglayer 230 may include an inorganic material or an organic material. Inan exemplary embodiment, any one of the first touch insulating layer 215and the second touch insulating layer 230 may include an inorganicmaterial, and the other one may include an organic material. In anexemplary embodiment, the first touch insulating layer 215 may include asilicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer or an aluminum oxide layer, and the secondtouch insulating layer 230 may include at least any one of acrylicresin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin,urethane resin, cellulose resin, siloxane resin, polyimide resin,polyamide resin, and perylene resin, for example.

The touch layer TSP may further include a light shielding pattern 240and an overcoat layer 250 disposed on the second touch insulating layer230.

The light shielding pattern 240 may be disposed on the second touchinsulating layer 230. The light shielding pattern 240 may reduce thereflection of external light and improve the feeling of color ofreflected light. The light shielding pattern 240 is disposed in thenon-light emitting region NEM. In an exemplary embodiment, the lightshielding pattern 240 may have a lattice shape or a mesh shape in a planview, for example. The light shielding pattern 240, the touch conductivelayers 210 and 220, and the bank layer 126 may all be disposed in thenon-light emitting region NEM and may overlap each other in thethickness direction. A width of the light shielding pattern 240 may besmaller than or equal to a width of the bank layer 126 and greater thanwidths of the touch conductive layers 210 and 220. The light shieldingpattern 240 may not overlap the light emitting region EMA.

The overcoat layer 250 is disposed on the light shielding pattern 240.The overcoat layer 250 may be disposed directly on the light shieldingpattern 240. The overcoat layer 250 may serve to protect the lightshielding pattern 240 by covering the light shielding pattern 240. In anexemplary embodiment, the overcoat layer 250 may further serve toplanarize the surface.

In another exemplary embodiment, the light shielding pattern 240 and/orthe overcoat layer 250 described above may be omitted.

The polarizing bonding layer PLA is disposed on the overcoat layer 250,and the polarizing member POL is disposed on the polarizing bondinglayer PLA. The polarizing member POL may include a polarizing film 260.The polarizing film 260 may be attached onto the touch layer TSP by thepolarizing bonding layer PLA including an adhesive or the like.

The polarizing film 260 may include a polarizing layer 263 andprotective members 261 and 262 which sandwich the polarizing layer 263from above and below. The polarizing layer 263 may include a polyvinylalcohol film. The polarizing layer 263 may be stretched in onedirection. The stretching direction of the polarizing layer 263 may bean absorption axis, and a direction perpendicular to the stretchingdirection may be a transmission axis. The protective members 261 and 262may be disposed on a surface and the other surface of the polarizinglayer 263, respectively. In an exemplary embodiment, the protectivemembers 261 and 262 may include, but not limited to, cellulose resin,such as triacetyl cellulose, or polyester resin.

The transparent bonding layer 30 is disposed on the polarizing memberPOL, that is, the polarizing film 260, and the window member 20 isdisposed on the transparent bonding layer 30. Since the transparentbonding layer 30 and the window member 20 have been described above indetail, a redundant description thereof is omitted.

FIG. 7 is a cross-sectional view around the hole region HLA of thedisplay device 1 of FIG. 6.

Referring to FIGS. 6 and 7, the first through hole HLE_TH1 may penetratethe substrate 100, organic layers 128 and 129 disposed on the substrate100, the touch layer TSP, the polarizing bonding layer PLA, and thepolarizing film 260. Inner walls of the layers constituting the firstthrough hole HLE_TH1 may be aligned with each other.

A dam structure DAM may be disposed around the first through holeHLE_TH1. The dam structure DAM may include the stacked insulating layers105, 121, 122, 123, 124, 126 and 127. A groove TCH defined by removingthe insulating layers 105, 121, 122, 123, 124 and 126 and the metallayers 130, 140, 150, 160 and 180 except for the substrate 100 may bedisposed between the dam structure DAM and the pixel PX. At least aportion of the thin-film encapsulation layer 190 may be disposed in thegroove TCH. In an exemplary embodiment, the first organic layer 192 ofthe thin-film encapsulation layer 190 may extend up to the dam structureDAM and may not be disposed in the hole region HLA beyond the damstructure DAM, for example. That is, the dam structure DAM may preventthe first organic layer 192 from overflowing to the hole region HLA. Thefirst inorganic layer 191 or the second inorganic layer 193 of thethin-film encapsulation layer 190 may further extend beyond the damstructure DAM. Although the first inorganic layer 191 and the secondinorganic layer 193 do not extend to the first through hole HLE_TH1 butend on the dam structure DAM before the first through hole HLE_TH1 inthe drawing, the invention is not limited to this case.

The thin-film encapsulation layer 190 around the hole region HLA mayslope downward toward the first through hole HLE_TH1. One or moreorganic layers 128 and 129 may be further disposed on the thin-filmencapsulation layer 190 in order to planarize an inclined surface aroundthe hole region HLA. In an exemplary embodiment, a second organic layer128 may be disposed on the first organic layer 192, and a third organiclayer 129 may be disposed on the second organic layer 128, for example.The second organic layer 128 and the third organic layer 129 mayplanarize an inclined step around the hole region HLA by filling theinclined step. In an exemplary embodiment, the second organic layer 128and the third organic layer 129 may be exposed to the first through holeHLE_TH1 and may constitute the inner wall of the first through holeHLE_TH1. Accordingly, the inner wall of the first through hole HLE_TH1may be composed of respective side surfaces of the substrate 100, thebuffer layer 105, the second organic layer 128, the third organic layer129, the touch base layer 205, the first touch insulating layer 215, thesecond touch insulating layer 230, the overcoat layer 250, thepolarizing bonding layer PLA, and the polarizing film 260. The innerwall of the first through hole HLE_TH1 may be covered by the holecoating layer HCVB as described above.

A method of manufacturing the exemplary embodiment of the display device1 of FIG. 3 will now be described.

FIGS. 8 through 11 are cross-sectional views illustrating an exemplaryembodiment of steps of a method of manufacturing a display device.

Referring to FIG. 8, first, a laminate LAM of a display panel 10 and apolarizing member POL is prepared. The laminate LAM may be provided byattaching the polarizing member POL onto a surface of the display panel10 using a method such as lamination.

Referring to FIG. 9, a first through hole HLE_TH1 is defined in a holeregion HLA of the laminate LAM. The first through hole HLE_TH1 may bedefined using, e.g., a laser LSR. The first through hole HLE_TH1physically penetrates the display panel 10 and the polarizing member POLin the thickness direction. Since a through hole of the display panel 10and a through hole of the polarizing member POL are defined in the sameprocess, their inner walls may be aligned with each other, and theirinner diameters may be the same.

As a result of forming the first through hole HLE_TH1, the display panel10 and the polarizing member POL may be exposed toward an inner wall ofthe first through hole HLE_TH1. In the case of the display panel 10, aregion where the first through hole HLE_TH1 is defined may be finishedwith an encapsulation structure (refer to ‘190’ in FIG. 7), a groove TCHand a dam structure DAM as described above with reference to FIG. 7.Therefore, it is possible to prevent propagation of cracks andpermeation of moisture or outside air into an active region AAR. In thecase of the polarizing member POL provided as a film, it is difficult tohave a different structure in each region, and the active region may bedirectly exposed by physical penetration. Since the polarizing memberPOL may discolor or locally shrink when exposed to moisture as describedabove, the inner wall of the first through hole HLE_TH1 may be coatedwith a hole coating layer HCVB in a subsequent process.

The hole coating layer HCVB may be provided not only on the exposedinner wall of the polarizing member POL but also on the inner wall ofthe display panel 10 laminated together with the polarizing member POL.It may be easier to form the hole coating layer HCVB on both the innerwall of the polarizing member POL and the inner wall of the displaypanel 10 than to form the hole coating layer HCVB only on the inner wallof the polarizing member POL. In addition, when the hole coating layerHCVB is defined also on the inner wall of the display panel 10,unnecessary steps inside the first through hole HLE_TH1 may be reduced,permeation of moisture or the like into the active region AAR of thedisplay panel 10 may be prevented.

FIGS. 10A through 10C illustrate methods of forming the hole coatinglayer HCVB according to various embodiments.

In an exemplary embodiment, the hole coating layer HCVB may be providedin a contact coating manner as illustrated in FIG. 10A. Specifically,the inner wall of the first through hole HLE_TH1 may be coated with acoating layer composition HCC by smearing the coating layer compositionHCC onto a contact pad CTP including a silicon pad, inserting thecontact pad CTP into the first through hole HLE_TH1, and then smearingor transferring the coating layer composition HCC onto the inner wall ofthe first through hole HLE_TH1.

In an exemplary embodiment, the hole coating layer HCVB may be providedin a contactless coating manner as illustrated in FIG. 10B.Specifically, a spray bar ZBR including one or more spray holes ZHL inits side surface is inserted into the first through hole HLE_TH1. Then,the spray bar ZBR is rotated to spray the coating layer composition HCCthrough the spray holes ZHL, thereby coating the inner wall of the firstthrough hole HLE_TH1 with the coating layer composition HCC.

In an exemplary embodiment, the hole coating layer HCVB may be providedas illustrated in FIG. 10C. Specifically, the inner wall of the firstthrough hole HLE_TH1 may be coated with the coating layer compositionHCC by placing a mask MSK, which exposes the first through hole HLE_TH1,on or above a surface of the laminate LAM (a surface of the polarizingmember POL) and spraying the coating layer composition HCC into thefirst through hole HLE_TH1 using a spray nozzle NZZ.

The coating layer composition HCC coated using a method such as those ofFIGS. 10A through 10C may be dried and/or cured into the hole coatinglayer HCVB. In an exemplary embodiment, the curing of the coating layercomposition HCC may be achieved by, but not limited to, ultravioletcuring and/or heat curing.

When the hole coating layer HCVB is disposed on the inner wall of thefirst through hole HLE_TH1 of the laminate LAM using the above method,an inner diameter of the first through hole HLE_TH1 of the laminate LAMmay be reduced by a thickness of the hole coating layer HCVB.

Referring to FIG. 11, a transparent bonding layer 30 is attached ontothe laminate LAM including the hole coating layer HCVB. The attachmentof the transparent bonding layer 30 may be achieved by lamination orcoating. A second through hole HLE_TH2 may be defined in the transparentbonding layer 30 attached such that the second through hole HLE_TH2 ispositioned inside the first through hole HLE_TH1 of the laminate LAM ina plan view. The transparent bonding layer 30 in which the secondthrough hole HLE_TH2 is defined may be attached onto the laminate LAM,but the second through hole HLE_TH2 may also be defined in a state wherethe transparent bonding layer 30 is attached onto the laminate LAM.

Next, referring to FIG. 3, a window member 20 is attached onto thetransparent bonding layer 30. The window member 20 includes a pattern ofa print layer 22 defining an optical hole HLE_OP. The optical holeHLE_OP may overlap the first through hole HLE_TH1 of the laminate LAMand the second through hole HLE_TH2 of the transparent bonding layer 30.The optical hole HLE_OP may have a smaller inner diameter than the firstthrough hole HLE_TH1 of the laminate LAM and/or the second through holeHLE_TH2 of the transparent bonding layer 30 and may be located insidethe first through hole HLE_TH1 and/or the second through hole HLE_TH2.

Although the window member 20 is attached after the transparent bondinglayer 30 is attached to the laminate LAM in the above-describedembodiment, the transparent bonding layer 30 may first be attached tothe window member 20, and then the window member 20 including thetransparent bonding layer 30 may be attached to the laminate LAM in anexemplary embodiment. In an alternative exemplary embodiment, thetransparent bonding layer 30 and the window member 20 may be laminatedsimultaneously.

Hereinafter, other exemplary embodiments will be described.

FIG. 12 is a cross-sectional view around an exemplary embodiment of ahole region HLA of a display device.

Referring to FIG. 12, the illustrated exemplary embodiment of thedisplay device is different from the exemplary embodiment of FIG. 3 inthat a transparent bonding layer 31 does not include a second throughhole HLE_TH2. Since the transparent bonding layer 31 itself has highlight transmittance, even when the transparent bonding layer 31, like awindow base 21, covers the hole region HLA, it may pass external lightso that the external light may reach a light receiving portion of anoptical element OPS. The light transmittance of the optical hole HLE_OPmay be somewhat reduced as compared with the exemplary embodiment ofFIG. 3, but it may be more advantageous for maintaining a uniform lighttransmittance inside the optical hole HLE_OP because there is noalignment issue between the second through hole HLE_TH2 of thetransparent bonding layer 31 and a first through hole HLE_TH1 of alaminate LAM of a display panel 10 and a polarizing member POL.

FIG. 13 is a cross-sectional view around an exemplary embodiment of ahole region of a display device.

Referring to FIG. 13, the illustrated exemplary embodiment of thedisplay device is different from the exemplary embodiment of FIG. 3 inthat a hole coating layer HCVW includes clear resin. When the holecoating layer HCVW is transparent, it is difficult for the hole coatinglayer HCVW to perform the function of preventing the leakage of light byitself. However, the light leakage prevention function may besupplemented by fully covering a through hole HLE with a pattern of aprint layer 22 of a window member 20. In this regard, in the illustratedexemplary embodiment, the print layer 22 may overlap the hole coatinglayer HCVW in the thickness direction and may completely cover the holecoating layer HCVW.

FIGS. 14 and 15 are cross-sectional views of exemplary embodiments ofhole regions of display devices.

The exemplary embodiments of FIGS. 14 and 15 show that a hole coatinglayer HCVW not only covers an inner wall of a first through hole HLE_TH1of a laminate LAM of a display panel 10 and a polarizing member POL butalso fills the first through hole HLE_TH1. In this case, the holecoating layer HCVW may include a transparent material in order to securean optical hole HLE_OP.

In an exemplary embodiment, referring to FIG. 14, a thickness of thehole coating layer HCVW may be substantially the same as a thickness ofthe laminate LAM and may be uniform overall. In the exemplary embodimentof FIG. 14, a surface and the other surface of the hole coating layerHCVW may be flat and may be substantially parallel to each other.

In an exemplary embodiment, referring to FIG. 15, the thickness of thehole coating layer HCVW may be maximum in a region adjacent to an innerwall of the laminate LAM and may be reduced toward a center. In theexemplary embodiment of FIG. 15, a surface and/or the other surface ofthe hole coating layer HCVW may include a concave surface.

FIG. 16 is a cross-sectional view around an exemplary embodiment of ahole region of a display device.

The exemplary embodiment of FIG. 16 shows that the display device mayinclude both a hole coating layer HCVB and a filler FLLW in a firstthrough hole HLE_TH1. Specifically, an inner wall of the first throughhole HLE_TH1 may be covered with the hole coating layer HCVB, and aspace defined by the hole coating layer HCVB may be filled with thefiller FLLW. The filler FLLW may contact the hole coating layer HCVB.The hole coating layer HCVB may include a black material as in theexemplary embodiment of FIG. 3 or a transparent material as in theexemplary embodiment of FIG. 13. The filler FLLW may include atransparent material.

In concluding the detailed description, those skilled in the art willappreciate that many variations and modifications may be made to thepreferred embodiments without substantially departing from theprinciples of the invention. Therefore, the disclosed preferredembodiments of the invention are used in a generic and descriptive senseonly and not for purposes of limitation.

What is claimed is:
 1. A display device including an active region and anon-active region, the display device comprising: a display panelcomprising a plurality of pixels in the active region, the display panelincluding a first surface, a second surface facing the first surface anda first through hole penetrating from the first surface to the secondsurface; a transparent bonding layer on the first surface of the displaypanel; and a window on the transparent bonding layer, the window layercomprises a base and a print layer defining an optical opening inside onthe base, wherein the optical opening overlaps the first through hole,and an inner diameter of the optical opening is smaller than an innerdiameter of the first through hole.
 2. The display device of claim 1,wherein the transparent bonding layer includes a second through holewhich overlaps the first through hole.
 3. The display device of claim 2,wherein an inner diameter of the second through hole is greater than theinner diameter of the optical opening.
 4. The display device of claim 3,wherein the inner diameter of the second through hole is smaller thanthe inner diameter of the first through hole.
 5. The display device ofclaim 1, wherein the transparent bonding layer overlaps an inner wall ofthe first through hole.
 6. The display device of claim 5, wherein thetransparent bonding layer further overlaps an inner wall of the opticalopening.
 7. The display device of claim 1, wherein the print layercovers an inner wall of the first through hole.
 8. The display device ofclaim 1, wherein the optical opening is surrounded by the print layer ina plan view.
 9. The display device of claim 1, wherein the first throughhole and the optical opening are surrounded by the active region in aplan view.
 10. The display device of claim 1, wherein the first throughhole is positioned in the non-active region.
 11. The display device ofclaim 1, wherein the display panel comprises: a substrate; a transistoron the substrate; an insulating layer over the transistor; a firstelectrode connected to the transistor; a light emitting layer on thefirst electrode; and a second electrode on the light emitting layer. 12.The display device of claim 11, wherein the display panel furthercomprises a thin film encapsulation layer on the second electrode, thethin film encapsulation layer including a first inorganic layer, anorganic layer on the first inorganic layer and a second inorganic layeron the organic layer.
 13. The display device of claim 12, wherein thedisplay panel further comprises a dam structure disposed adjacent thefirst through hole.
 14. The display device of claim 13, wherein the damstructure includes the insulating layer.
 15. The display device of claim13, wherein the first inorganic layer and the second inorganic layercontact with each other on the dam structure.
 16. The display device ofclaim 12, wherein the display panel further comprises a touch member onthe thin film encapsulation layer including, the touch member includingat least one touch conductive layer and at least one touch insulatinglayer.
 17. The display device of claim 11, wherein the substratecomprises a first sub-substrate, a second sub-substrate and a barrierlayer between the first sub-substrate and the second sub-substrate.